Epoxy resins, phenolic resins, and unsaturated polyester (UPE) resins make up the industry referred to as thermosetting resins. Thermosets are used in a variety of applications, such as casting, coatings, adhesives and laminate applications. Epoxy resin is widely used for printed circuit boards used in computers and electronics.

Tetrabromobisphenol A (Great Lakes BA-59P™), which reacts into the epoxy matrix, is the industry standard flame retardant for circuit board manufacture. If an additive flame retardant is preferred, we offer Great Lakes DE-83R™. We also offer a choice of liquid additives if you prefer a non-diphenyl ether.

If your application requires a halogen-free flame retardant, Reofos® 95 will enable you to achieve a UL 94 V-0 in an aromatic amine cured epoxy resin. Tribromophenol (Great Lakes PH-73FF™) is used in brominated epoxy oligomers. It is a new form of PH-73™ available in briquette form, which ensures it remains in the polymer.

Contact our Technical Service group for expert advice on choosing our best product for your requirements.

Polymers and Applications